Title:
RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/286571
Kind Code:
A1
Abstract:
The present invention provides: a resin composition which enables the achievement of a cured product having excellent pattern rectangularity; a cured product which is obtained by curing the resin composition; a multilayer body which comprises the cured product; a method for producing the cured product; a method for producing the multilayer body; a method for producing a semiconductor device, the method comprising the method for producing the multilayer body; and a semiconductor device which comprises the cured product or the multilayer body. The present invention provides: a resin composition that contains a resin and a base generator which has an α,β-unsaturated ketone group at a site where a base is to be generated, and which generates a base that is cyclized within the molecule, thereby forming a tertiary amine; a cured product which is obtained by curing the resin composition; a multilayer body which comprises the cured product; a method for producing the cured product; a method for producing the multilayer body; a method for producing a semiconductor device, the method comprising the method for producing the multilayer body; and a semiconductor device which comprises the cured product or the multilayer body.
Inventors:
ASAKAWA DAISUKE (JP)
Application Number:
PCT/JP2022/025432
Publication Date:
January 19, 2023
Filing Date:
June 27, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F290/06; B32B27/18; C08L79/04; G03F7/027; G03F7/039
Foreign References:
| JP2010254982A | 2010-11-11 | |||
| JP2002265531A | 2002-09-18 |
Attorney, Agent or Firm:
YONEKURA Junzo et al. (JP)
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