Title:
RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/010026
Kind Code:
A1
Abstract:
The present invention provides: a resin composition which contains a solvent and at least one resin that is selected from the group consisting of a polyimide precursor, a polyimide, a polyamide-imide precursor, a polyamide-imide and a polyamide, wherein the content of N-methyl pyrrolidone and the content of γ-butyrolactone relative to the total mass of the resin composition are both 0.1% by mass or less; a cured product which is obtained by curing this resin composition; a multilayer body which comprises this cured product; a method for producing a cured product; a method for producing a multilayer body; a method for producing a semiconductor device, the method comprising this method for producing a multilayer body; and a semiconductor device which comprises this cured product or this multilayer body.
Inventors:
KITAJIMA SHUNSUKE (JP)
Application Number:
PCT/JP2023/024885
Publication Date:
January 11, 2024
Filing Date:
July 05, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08L79/08; B32B15/08; C08F290/14; C08G73/10; C08K5/1545; C08K5/41; C08L77/00; G03F7/004; G03F7/027; G03F7/037
Domestic Patent References:
| WO2021182499A1 | 2021-09-16 | |||
| WO2017038598A1 | 2017-03-09 | |||
| WO2019193647A1 | 2019-10-10 | |||
| WO2014115233A1 | 2014-07-31 |
Foreign References:
| JP2021181552A | 2021-11-25 | |||
| JP2019094424A | 2019-06-20 | |||
| JP2022010104A | 2022-01-14 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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