Title:
RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/171554
Kind Code:
A1
Abstract:
Provided are: a resin composition having excellent moisture absorption heat resistance while maintaining excellent low dielectric properties (Dk and/or Df); a cured product; a prepreg; a metal foil-clad laminate; a resin composite sheet; a printed circuit board; and a semiconductor device. The resin composition comprises a compound (M) represented by formula (M), a polymer (V) having a constituent unit represented by formula (V), and a compound (M1) represented by formula (M1). In formula (V), Ar represents an aromatic hydrocarbon linking group.
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Inventors:
HASHIGUCHI KAZUHIRO (JP)
HASEBE KEIICHI (JP)
HIRANO SHUNSUKE (JP)
KOBAYASHI TAKASHI (JP)
NAKASHIMA YUJI (JP)
HASEBE KEIICHI (JP)
HIRANO SHUNSUKE (JP)
KOBAYASHI TAKASHI (JP)
NAKASHIMA YUJI (JP)
Application Number:
PCT/JP2023/007986
Publication Date:
September 14, 2023
Filing Date:
March 03, 2023
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08F299/00; B32B15/08; C08J5/24; C08L25/02; C08L39/00; C08L101/00; H05K1/03
Domestic Patent References:
| WO2020175538A1 | 2020-09-03 | |||
| WO2020175537A1 | 2020-09-03 | |||
| WO2022054867A1 | 2022-03-17 | |||
| WO2022202346A1 | 2022-09-29 |
Foreign References:
| CN113121999A | 2021-07-16 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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