Title:
RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL CLAD LAMINATED PLATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, SEMICONDUCTOR DEVICE, AND PRINTED WIRING BOARD MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/210567
Kind Code:
A1
Abstract:
Provided are: a resin composition that can, when formed into a cured product, suppress backside exposure; and a cured product, a prepreg, a metal foil clad laminated plate, a resin composite sheet, a printed wiring board, a semiconductor device, and a printed wiring board manufacturing method, all using the resin composition. The resin composition contains a thermosetting compound. A cured product, of the resin composition, molded so as to have a thickness of 30 μm exhibits a transmission rate of 0.070% or less with respect to g-line (wavelength 436 nm), h-line (wavelength 405 nm), and i-line (wavelength 365 nm).
Inventors:
KOMATSU KOUKI (JP)
OKUMURA KEISUKE (JP)
MORISHITA TOMOE (JP)
HIGASHIHARA KEI (JP)
HASEBE KEIICHI (JP)
OKUMURA KEISUKE (JP)
MORISHITA TOMOE (JP)
HIGASHIHARA KEI (JP)
HASEBE KEIICHI (JP)
Application Number:
PCT/JP2023/016071
Publication Date:
November 02, 2023
Filing Date:
April 24, 2023
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L101/12; B32B15/08; C08J5/24; C08K3/013; H05K1/03
Domestic Patent References:
| WO2019082698A1 | 2019-05-02 |
Foreign References:
| JPH03262185A | 1991-11-21 | |||
| JP2003012838A | 2003-01-15 | |||
| JPH05104685A | 1993-04-27 | |||
| JP2018044120A | 2018-03-22 | |||
| JP2017095599A | 2017-06-01 | |||
| JP2019119812A | 2019-07-22 | |||
| CN102796478A | 2012-11-28 | |||
| JPH05186762A | 1993-07-27 | |||
| JPH05220894A | 1993-08-31 | |||
| JPH11228718A | 1999-08-24 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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