Title:
RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2024/090409
Kind Code:
A1
Abstract:
Provided are: a resin composition capable of providing a novel cured product; a cured product; a prepreg; a metal foil-clad laminate; a resin composite sheet; and a printed wiring board. The present invention provides a resin composition containing: a polymaleimide compound (A); and a cyanate ester compound (B) having, in a molecule thereof, two or more aromatic moieties substituted with at least one cyanato group, wherein the polymaleimide compound (A) comprises an aromatic amine compound (a1) having 1-3 alkyl groups in an aromatic ring, an aromatic divinyl compound (a2) having two ethenyl groups, and maleic anhydride as reaction raw materials (1).
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| JPWO2012165448 | Resin composition and semiconductor device substrate |
Inventors:
KOBAYASHI TAKASHI (JP)
KAMATA YUJI (JP)
HASEBE KEIICHI (JP)
KAMATA YUJI (JP)
HASEBE KEIICHI (JP)
Application Number:
PCT/JP2023/038271
Publication Date:
May 02, 2024
Filing Date:
October 24, 2023
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08F283/00; B32B5/28; B32B15/08; C08J5/24; C08K3/013; C08K5/49; C08L65/00; C08L79/04; H05K1/03
Domestic Patent References:
| WO2017006896A1 | 2017-01-12 |
Foreign References:
| JP7160151B1 | 2022-10-25 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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