Title:
RESIN COMPOSITION, CURED PRODUCT, PRODUCTION METHOD FOR CURED PRODUCT, ELECTRONIC COMPONENT, DISPLAY DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/276517
Kind Code:
A1
Abstract:
Provided are a resin composition that has a high breaking elongation and that has high crack resistance even after a thermal cycling test, a cured product obtained from said resin composition, and an electronic component, a display device, and a semiconductor device. This resin composition contains an (A) resin and a (B) resin, each of which has a specified structure at the ends thereof, said (A) resin and (B) resin containing at least one selected from the group consisting of a polyamide, a polyimide, a polybenzoxazole, precursors thereof, and copolymers thereof.
Inventors:
SHOJI YU (JP)
OGASAWARA HISASHI (JP)
ARAKI HITOSHI (JP)
OGASAWARA HISASHI (JP)
ARAKI HITOSHI (JP)
Application Number:
PCT/JP2022/021888
Publication Date:
January 05, 2023
Filing Date:
May 30, 2022
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08L79/08; C08G73/10; C08G73/22; C08K3/011; C08L61/00; C08L77/00; G03F7/023; G03F7/037; G03F7/20
Domestic Patent References:
| WO2012133429A1 | 2012-10-04 | |||
| WO2018003725A1 | 2018-01-04 | |||
| WO2018037997A1 | 2018-03-01 |
Foreign References:
| JP2020020975A | 2020-02-06 | |||
| JP2004224894A | 2004-08-12 | |||
| JP2010159402A | 2010-07-22 | |||
| JP2016132736A | 2016-07-25 |
Download PDF:
Previous Patent: HIGH-STRENGTH STEEL SHEET AND METHOD FOR PRODUCING SAME
Next Patent: TEMPERATURE SENSOR
Next Patent: TEMPERATURE SENSOR