Title:
RESIN COMPOSITION, CURED PRODUCT SHEET, COMPOSITE MOLDED BODY AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/210686
Kind Code:
A1
Abstract:
The present invention provides: a resin composition which has high thermal conductivity, high insulation properties and high heat resistance, while forming a sheet that has excellent handling properties; a cured product sheet; a composite molded body; and a semiconductor device. The present invention uses a resin composition which contains an inorganic filler and a thermosetting resin, wherein: the inorganic filler content in the solid content of the resin composition is 50% by volume or more; the inorganic filler contains 82% by volume or more of a boron nitride filler (A); the boron nitride filler contains filler aggregates; the thermosetting resin contains an epoxy resin that has a mass average molecular weight of 5,000 or more; the epoxy equivalent weight (WPE) of the resin component in the resin composition satisfies 100 ≤ WPE ≤ 300; and the storage elastic modulus E' of a cured product of the resin composition satisfies 1 ≥ (E' at 270°C)/(E' at 30°C) ≥ 0.2.
Inventors:
SAWAMURA TOSHIYUKI (JP)
TANAKA TOSHIYUKI (JP)
TANAKA TOSHIYUKI (JP)
Application Number:
PCT/JP2022/015374
Publication Date:
October 06, 2022
Filing Date:
March 29, 2022
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
H01L23/373; C08K3/38; C08K7/18; C08L63/00
Domestic Patent References:
| WO2019189746A1 | 2019-10-03 | |||
| WO2015119198A1 | 2015-08-13 | |||
| WO2015119198A1 | 2015-08-13 | |||
| WO2019189746A1 | 2019-10-03 | |||
| WO2015561028A1 |
Foreign References:
| JP2018188628A | 2018-11-29 | |||
| JP2017036415A | 2017-02-16 | |||
| JP2015006980A | 2015-01-15 | |||
| JP2021055114A | 2021-04-08 | |||
| JP2013089670A | 2013-05-13 | |||
| JP2015006985A | 2015-01-15 | |||
| JP2016135730A | 2016-07-28 | |||
| JP2017036415A | 2017-02-16 | |||
| JP2020063438A | 2020-04-23 |
Other References:
"Ceramics", vol. 43, 2008, THE CERAMIC SOCIETY OF JAPAN
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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