Title:
RESIN COMPOSITION, CURED PRODUCT, SHEET-LIKE LAYERED MATERIAL, RESIN SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/149521
Kind Code:
A1
Abstract:
Provided is a resin composition with which it is possible to obtain a cured product wherein the dielectric loss tangent can be kept low and increases in the melt viscosity can be suppressed. This resin composition contains (A) a silane compound represented by formula (A-1), (B) an epoxy resin, and (C) an active ester compound. Formula (A-1): (RO)nSiAr4-n (In the formula, R represents an alkyl group, Ar represents an aryl group, and n represents 1 or 2.)
Inventors:
KAWAI KENJI (JP)
KISHIDA TAKASHI (JP)
KISHIDA TAKASHI (JP)
Application Number:
PCT/JP2023/003461
Publication Date:
August 10, 2023
Filing Date:
February 02, 2023
Export Citation:
Assignee:
AJINOMOTO KK (JP)
International Classes:
C08L63/00; B32B27/38; C08G59/40; C08K3/013; C08K5/5419; C08K9/06; H05K1/03
Domestic Patent References:
| WO2017010403A1 | 2017-01-19 |
Foreign References:
| JP2021161323A | 2021-10-11 | |||
| JP2016008280A | 2016-01-18 | |||
| JP2007217683A | 2007-08-30 | |||
| JP2009249424A | 2009-10-29 | |||
| JP2020050826A | 2020-04-02 | |||
| JP2021107496A | 2021-07-29 | |||
| JP2020132676A | 2020-08-31 | |||
| JP2010144086A | 2010-07-01 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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