RESIN COMPOSITION, CURED SUBSTANCE, SEALING MATERIAL, ADHESIVE, INSULATING MATERIAL, COATING MATERIAL, PREPREG, MULTILAYER BODY, AND FIBER-REINFORCED COMPOSITE MATERIAL

Title:

RESIN COMPOSITION, CURED SUBSTANCE, SEALING MATERIAL, ADHESIVE, INSULATING MATERIAL, COATING MATERIAL, PREPREG, MULTILAYER BODY, AND FIBER-REINFORCED COMPOSITE MATERIAL

Document Type and Number:

WIPO Patent Application WO/2023/228509

Kind Code:

A1

Abstract:

Provided are a resin composition having an excellent potential while maintaining excellent heat tolerance, as well as a cured substance, a sealing material, an adhesive, an insulating material, a coating material, a prepreg, a multilayer body, and a fiber-reinforced composite material. The resin composition contains a cyanic acid ester compound (A), an amine adduct compound (B), and boric acid ester (C).

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Inventors:

IKEDA KOUSUKE (JP)
YASUDA YOSHIHIRO (JP)
KATAGIRI MASAYUKI (JP)

Application Number:

PCT/JP2023/008298

Publication Date:

November 30, 2023

Filing Date:

March 06, 2023

Export Citation:

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Assignee:

MITSUBISHI GAS CHEMICAL CO (JP)

International Classes:

C08G73/06; C08G61/02; C08J5/04; C08J5/24; C09D7/63; C09D179/00; C09J11/06; C09J179/00

Foreign References:

CN112048271A	2020-12-08
CN110591622A	2019-12-20
JP2011016967A	2011-01-27
JP2013151700A	2013-08-08
JP2017132896A	2017-08-03

Attorney, Agent or Firm:

SIKS & CO. (JP)

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