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Patent Searching and Data


Title:
RESIN COMPOSITION FOR CUTTING, RESIN MOLDED BODY FOR CUTTING, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/235218
Kind Code:
A1
Abstract:
[Problem] To provide: a resin composition for cutting such that cutting time is reduced and an object which is to be cut and has an excellent external appearance can be produced therefrom; a resin molded body for cutting that includes the resin composition for cutting; and a method for manufacturing the same. [Solution] The resin composition for cutting comprises, as a basic composition, a total of 100 weight% including 40 to 97 weight% of a resin and 60 to 3 weight% of an inorganic filler, and has a cuttability parameter of 100 or less, which is calculated from the heat deflection temperature and the tensile modulus.

Inventors:
NISHIDA KOJI (JP)
KATO YUKAKO (JP)
YAGISHITA ISAMU (JP)
Application Number:
PCT/JP2017/022967
Publication Date:
December 27, 2018
Filing Date:
June 22, 2017
Export Citation:
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Assignee:
POLYMER ASS GODOKAISHA (JP)
International Classes:
C08L101/00; A61C5/70; A61C13/08; A61K6/891; C08J5/00; C08K3/00
Domestic Patent References:
WO2017073572A12017-05-04
Foreign References:
JPH10323353A1998-12-08
JP2017048121A2017-03-09
JPH08301716A1996-11-19
Attorney, Agent or Firm:
KAWANAMI Kaoru et al. (JP)
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