Title:
RESIN COMPOSITION FOR DICING FILM SUBSTRATE, DICING FILM SUBSTRATE, AND DICING FILM
Document Type and Number:
WIPO Patent Application WO/2022/196392
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin composition for dicing film substrates which is able to form dicing film substrates excellent in terms of ordinary-temperature and low-temperature stretchability and ordinary-temperature and low-temperature modulus strength. The resin composition for dicing film substrates comprises an ionomer (A) of an ethylene/(unsaturated carboxylic acid)-based copolymer, a polyamide (B), and a styrene-based resin (C).
Inventors:
NAKANO SHIGENORI
NISHIJIMA KOICHI
SAKUMA MASAMI
TAKAOKA HIROKI
NISHIJIMA KOICHI
SAKUMA MASAMI
TAKAOKA HIROKI
Application Number:
PCT/JP2022/009398
Publication Date:
September 22, 2022
Filing Date:
March 04, 2022
Export Citation:
Assignee:
DOW MITSUI POLYCHEMICALS COMPANY LTD (JP)
International Classes:
C08L23/08; C08L25/04; C08L77/00; H01L21/301
Domestic Patent References:
| WO2018123804A1 | 2018-07-05 | |||
| WO2020031928A1 | 2020-02-13 |
Foreign References:
| JP2017098369A | 2017-06-01 |
Attorney, Agent or Firm:
WASHIDA & ASSOCIATES (JP)
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