Title:
RESIN COMPOSITION FOR DIE CLEANING
Document Type and Number:
WIPO Patent Application WO/2021/145199
Kind Code:
A1
Abstract:
Provided is a resin composition for die cleaning including a melamine resin, a filler, an acidic compound, and at least one compound selected from the group consisting of an imide compound having a molecular weight of 500 or less and a urea compound having a molecular weight of 500 or less. The acidic compound is a different compound from the imide compound, and the ratio of the total mass content of the imide compound and the urea compound to the mass content of the acidic compound is in the range of 0.01-100.0.
More Like This:
| JP6473656 | Metal object cleaning device and metal object cleaning method |
| JP6326157 | Resin cleaning agent |
| JP4090005 | Cleaning method |
Inventors:
YOSHIMURA KATSUNORI (JP)
IWATA JUN (JP)
FUKUNISHI YOUICHI (JP)
IWATA JUN (JP)
FUKUNISHI YOUICHI (JP)
Application Number:
PCT/JP2020/048853
Publication Date:
July 22, 2021
Filing Date:
December 25, 2020
Export Citation:
Assignee:
NIPPON CARBIDE KOGYO KK (JP)
International Classes:
B29C33/72
Domestic Patent References:
| WO2013011876A1 | 2013-01-24 |
Foreign References:
| JP2018119150A | 2018-08-02 | |||
| JPH0220538A | 1990-01-24 | |||
| JPH01139649A | 1989-06-01 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
Download PDF: