Title:
RESIN COMPOSITION FOR ENCAPSULATING AND ELECTRONIC DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2022/210384
Kind Code:
A1
Abstract:
This resin composition for encapsulating comprises an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin includes an epoxy resin having 2-6 epoxy groups per molecule, and the curing agent includes a compound having 2 or more active hydrogens per molecule. The ratio of the epoxy equivalent of the epoxy resin to the active hydrogen equivalent of the curing agent, which is the equivalent ratio, is 1.4-2.0.
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Inventors:
TAKAHASHI YUI (JP)
Application Number:
PCT/JP2022/014525
Publication Date:
October 06, 2022
Filing Date:
March 25, 2022
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08G59/20; C08G59/40; C08K3/013; C08L63/00
Domestic Patent References:
| WO2007007827A1 | 2007-01-18 | |||
| WO2020090491A1 | 2020-05-07 |
Foreign References:
| JPS61283615A | 1986-12-13 | |||
| JP2012241151A | 2012-12-10 | |||
| JP2014005383A | 2014-01-16 | |||
| JP2016141757A | 2016-08-08 | |||
| JP2017157618A | 2017-09-07 | |||
| JP2014179388A | 2014-09-25 | |||
| JP2011026419A | 2011-02-10 | |||
| JP2006206827A | 2006-08-10 | |||
| JP2005167035A | 2005-06-23 | |||
| JP2021060421A | 2021-04-15 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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