Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION, RESIN FILM, AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/085058
Kind Code:
A1
Abstract:
Provided is a resin composition including semiconductor particles (A) and a resin (B), wherein the content of a polymerizable compound (C) and the content of a polymerization initiator (D) with respect to the total solid content of the resin composition are both 0.01 mass% or less, and the ratio of the content of the semiconductor particles (A) to the content of the resin (B) is 0.90 or less by mass ratio. Also provided are a resin film formed from said resin composition, and a display device including said resin film.

Inventors:
TOKUDA MASAYOSHI (JP)
KOMATSU YOSHIFUMI (JP)
TSUCHIYA MITSUO (JP)
NISHIKAWA YOSHINAGA YUKAKO (JP)
Application Number:
PCT/JP2022/039468
Publication Date:
May 19, 2023
Filing Date:
October 24, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08L101/00; C08J5/22; C08K3/08; C08K5/09
Domestic Patent References:
WO2008078678A12008-07-03
WO2008078686A12008-07-03
WO2012132558A12012-10-04
Foreign References:
JP2021067718A2021-04-30
JP2019095792A2019-06-20
JP2019159326A2019-09-19
JP2021161394A2021-10-11
JP2016065178A2016-04-28
JP2015529698A2015-10-08
JP2018123274A2018-08-09
JP2011132215A2011-07-07
JPH0675372A1994-03-18
JPH0675373A1994-03-18
JPS4838403A1973-06-06
JPS62174204A1987-07-31
JPH0710913A1995-01-13
JP2006309219A2006-11-09
JP2006310303A2006-11-09
JP2013015812A2013-01-24
JP2009251129A2009-10-29
JP2014002363A2014-01-09
Other References:
"Experimental Method for Polymer Synthesis", 1 March 1972, KAGAKU-DOJIN PUBLISHING COMPANY, INC
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: MEASUREMENT DEVICE AND MEASUREMENT METHOD

Next Patent: RESIN COMPOSITION, RESIN FILM, AND DISPLAY DEVICE