Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION, RESIN FILM, AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/085060
Kind Code:
A1
Abstract:
Provided is a resin composition including semiconductor particles (A) and a resin (B), wherein the content of a polymerizable compound (C) and the content of a polymerization initiator (D) with respect to the total solid content of the resin composition are both 0.01 mass% or less. Also provided are a resin film formed from said resin composition, and a display device including said resin film.

More Like This:
JP2002284787STABLE FREE-RADICAL COMPOUND AND POLYMER COMPOSITION CONTAINING THE SAME
JP3977563Thermoplastic resin composition
Inventors:
TOKUDA MASAYOSHI (JP)
KOMATSU YOSHIFUMI (JP)
TSUCHIYA MITSUO (JP)
NISHIKAWA YOSHINAGA YUKAKO (JP)
Application Number:
PCT/JP2022/039470
Publication Date:
May 19, 2023
Filing Date:
October 24, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08L101/00; C08J5/22; C08K3/08; C08K5/09
Foreign References:
JP2021067718A2021-04-30
JP2019095792A2019-06-20
JP2019159326A2019-09-19
JP2021161394A2021-10-11
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: RESIN COMPOSITION, RESIN FILM, AND DISPLAY DEVICE

Next Patent: RESIN FILM AND DISPLAY DEVICE