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Title:
RESIN COMPOSITION, FILM INCLUDING SAID RESIN COMPOSITION, AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/196220
Kind Code:
A1
Abstract:
A resin composition in which the content of a propylene-based polymer (A) satisfying a given requirement is 10-99.9 parts by mass, the content of a propylene-based polymer (B) satisfying a given requirement is 0-40 parts by mass, the content of a polyolefin (C) having a structural unit derived from an unsaturated carboxylic acid and/or a derivative thereof is 0.1-20 parts by mass, and the content of an ethylene-based polymer (D) satisfying a given requirement is 0-40 parts by mass (the sum of the contents of components (A), (B), (C), and (D) is taken as 100 parts by mass).

Inventors:
YOSHIMOTO KOYA (CN)
IZAIKE YUHEI (JP)
Application Number:
PCT/JP2022/005840
Publication Date:
September 22, 2022
Filing Date:
February 15, 2022
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08L23/10; B32B15/085; B32B27/32; B65D65/40; C08L23/04; C08L23/26; H01M50/121; H01M50/126; H01M50/534; H01M50/591
Domestic Patent References:
WO2018180862A12018-10-04
WO2018180165A12018-10-04
WO2019176403A12019-09-19
WO2014106887A12014-07-10
WO2011078054A12011-06-30
WO2004087775A12004-10-14
Foreign References:
JP2004269688A2004-09-30
JP2013241589A2013-12-05
JP2000301675A2000-10-31
JP4803441B22011-10-26
JP2014210841A2014-11-13
JP2014225378A2014-12-04
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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