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Patent Searching and Data


Title:
RESIN COMPOSITION, FLAT MOLDED BODY, MULTILAYER BODY, AND ANTI-REFLECTION MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2021/100661
Kind Code:
A1
Abstract:
Provided are: a resin composition from which a flat molded body having a high transparency, high refractive index, and high hardness can be provided; and a flat molded body, a multilayer body, and an anti-reflection molded body which are formed of the resin composition. The resin composition includes: 25-90 parts by mass of a copolymer resin (A) composed of a monomer composition a containing 37-96 mass% of a compound represented by formula (a-1), 1-60 mass% of an aromatic vinyl compound, and 3-62 mass% of an unsaturated dicarboxylic anhydride and/or a maleimide compound; and 10-75 parts by mass of a copolymer resin (B) composed of a monomer composition b containing 73-83 mass% of an aromatic vinyl compound and 17-27 mass% of an unsaturated dicarboxylic anhydride. In formula (a-1), Ra1 is a hydrogen atom or a methyl group, and Ra2 is an aliphatic group.

Inventors:
YAMAGUCHI MADOKA (JP)
Application Number:
PCT/JP2020/042636
Publication Date:
May 27, 2021
Filing Date:
November 16, 2020
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
B32B27/30; C08L25/00; C08L33/06
Domestic Patent References:
WO2019049704A12019-03-14
WO2015133530A12015-09-11
Foreign References:
JP2009279787A2009-12-03
JP2011116928A2011-06-16
JP2014098133A2014-05-29
JP2016525962A2016-09-01
JP2015049331A2015-03-16
Attorney, Agent or Firm:
SIKs & Co. (JP)
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