Title:
RESIN COMPOSITION FOR FORMING HARD COATING LAYER
Document Type and Number:
WIPO Patent Application WO/2019/146659
Kind Code:
A1
Abstract:
Provided is a resin composition for forming a hard coating layer, which is capable of forming a cured product that has not only high hardness but also excellent scratch resistance, bending resistance and cracking resistance. A resin composition for forming a hard coating layer according to the present invention is characterized by containing the components (A)-(D) described below.
Component (A): an alicyclic epoxy compound having a functionality of 3 or more and/or an oxetane compound having a functionality of 3 or more
Component (B): a polyfunctional (meth)acrylic compound
Component (C): a cationic photopolymerization initiator
Component (D): a radical photopolymerization initiator
More Like This:
Inventors:
EGAWA TOMOYA (JP)
HORIUCHI JUNPEI (JP)
HORIUCHI JUNPEI (JP)
Application Number:
PCT/JP2019/002130
Publication Date:
August 01, 2019
Filing Date:
January 23, 2019
Export Citation:
Assignee:
DAICEL CORP (JP)
International Classes:
C09D4/02; B32B27/36; B32B27/38; C09D163/00
Foreign References:
JP2004141732A | 2004-05-20 | |||
JP2003291239A | 2003-10-14 | |||
JP2005111756A | 2005-04-28 | |||
JP2016166307A | 2016-09-15 | |||
JP2003252954A | 2003-09-10 | |||
JPH11258790A | 1999-09-24 | |||
JP2017179099A | 2017-10-05 | |||
JP2007045899A | 2007-02-22 | |||
JP2015117382A | 2015-06-25 | |||
JP2007217704A | 2007-08-30 | |||
JP2018009929A | 2018-01-18 | |||
JP2018211263A | 2018-11-09 | |||
JPH0260696B2 | 1990-12-18 | |||
JP2005076005A | 2005-03-24 | |||
JP2003034761A | 2003-02-07 | |||
JPH0873771A | 1996-03-19 | |||
JP2006316249A | 2006-11-24 | |||
JP2008248169A | 2008-10-16 | |||
JP2008019422A | 2008-01-31 |
Attorney, Agent or Firm:
GOTO & CO. (JP)
Download PDF:
Previous Patent: WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Next Patent: SPUNBONDED NONWOVEN FABRIC
Next Patent: SPUNBONDED NONWOVEN FABRIC