RESIN COMPOSITION FOR FORMING PROTECTIVE FILM, PROTECTIVE FILM AND LAMINATE

Title:

RESIN COMPOSITION FOR FORMING PROTECTIVE FILM, PROTECTIVE FILM AND LAMINATE

Document Type and Number:

WIPO Patent Application WO/2023/032939

Kind Code:

A1

Abstract:

The present invention provides: a resin composition which is for forming a protective film and from which a protective film to which foreign substances derived from a substrate are less likely to adhere can be formed, in production lines and transportation lines; a protective film; and a laminate. The present invention is a resin composition which is for forming a protective film and is used for forming a protective film on a substrate, the protective film containing at least one selected from the group consisting of a polyvinyl alcohol resin, a plasticizer, and water.

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Inventors:

FUKATANI JUICHI (JP)

Application Number:

PCT/JP2022/032481

Publication Date:

March 09, 2023

Filing Date:

August 30, 2022

Export Citation:

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Assignee:

SEKISUI CHEMICAL CO LTD (JP)

International Classes:

C03C17/32; B32B27/30; C09D7/63; C09D129/04

Foreign References:

JPS48101410A	1973-12-20
JPS5930735A	1984-02-18
JPH10226537A	1998-08-25
JP2000239046A	2000-09-05
JP2016113179A	2016-06-23

Attorney, Agent or Firm:

WISEPLUS IP FIRM (JP)

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