Title:
RESIN COMPOSITION FOR GAS-BARRIER ADHESIVE, ADHESIVE, AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2018/105440
Kind Code:
A1
Abstract:
A resin composition for gas-barrier adhesives which comprises a resin (A) having two or more hydroxy groups in the molecule and at least one polyisocyanate (B) having two or more isocyanate groups and which gives a cured object having a glass transition temperature in the range of 25-150°C; an adhesive comprising the resin composition; and a laminate including an adhesive layer obtained from the adhesive. It is preferable that the polyisocyanate (B) include a polyisocyanate compound (b1) having a functionality of two or higher and having an aromatic ring in the molecule. It is preferable that the resin (A) have a polyester, polyester-polyurethane, polyether, or polyether-polyurethane structure as the main skeleton.
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Inventors:
SHIMOGUCHI MUTSUHIRO (JP)
ARAI MASAMITSU (JP)
HAYASHI MASANORI (JP)
SHIRAISHI KOUJI (JP)
TAKEDA HIROYUKI (JP)
ARAI MASAMITSU (JP)
HAYASHI MASANORI (JP)
SHIRAISHI KOUJI (JP)
TAKEDA HIROYUKI (JP)
Application Number:
PCT/JP2017/042550
Publication Date:
June 14, 2018
Filing Date:
November 28, 2017
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C09J175/04; C08G18/42; C08G18/72; C08L75/04; C09J7/20; C09J175/06
Domestic Patent References:
| WO2013027609A1 | 2013-02-28 |
Foreign References:
| JP2013123814A | 2013-06-24 | |||
| JP2015016657A | 2015-01-29 |
Attorney, Agent or Firm:
KONO Michihiro (JP)
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