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Title:
RESIN COMPOSITION HAVING EXCELLENT SURFACE SMOOTHNESS
Document Type and Number:
WIPO Patent Application WO/2014/132942
Kind Code:
A1
Abstract:
Although film grade polyethylene (PE) resins such as an ethylene/α olefin copolymer are highly economical, since the molecular weight distribution is narrow to allow for strength and heat sealability, in order to resolve the problem of a coated surface being rough when applied as a coating material for an insulated wire or cable, a polyolefin resin composition containing at least one type of PE resin is used, wherein, if a ratio (I10/I0.5) between the melt flow rate (MFR) (I10) measured at 190°C and 10 kg and the MFR (I0.5) measured at 190°C and 0.5 kg is denoted as MFRR, the difference between the MFRR of the polyolefin resin composition containing at least one type of PE and the MFRR of the PE resin is at least five.

Inventors:
CHIBA HIROKI (JP)
MIZUNO KOICHI (JP)
SHIRAI TOMOYUKI (JP)
Application Number:
PCT/JP2014/054422
Publication Date:
September 04, 2014
Filing Date:
February 25, 2014
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01B7/02; C08L23/08; C08L23/10; H01B3/44; H01B7/17
Domestic Patent References:
WO2005090466A12005-09-29
Foreign References:
JP2000344963A2000-12-12
JP2000290440A2000-10-17
JPH0652719A1994-02-25
JP2000143898A2000-05-26
JP2000503332A2000-03-21
JPS6227446A1987-02-05
JPH0940816A1997-02-10
JP2004231919A2004-08-19
JP2005146152A2005-06-09
JP2010189665A2010-09-02
Other References:
JIS HANDBOOK 26 PLASTIC I (TEST), 31 January 2001 (2001-01-31), pages 702 - 713
Attorney, Agent or Firm:
TOMONO, Eizo (JP)
Eizo Tomono (JP)
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