Title:
RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE
Document Type and Number:
WIPO Patent Application WO/2021/028991
Kind Code:
A1
Abstract:
One aspect of the present invention is a resin composition containing an acrylic resin obtained by polymerizing a monomer component that includes a monomer A represented by formula (1), and a heat-storing inorganic material. In the formula, R1 represents a hydrogen atom or a methyl group, and R2 represents a monovalent group having a polyoxyalkylene chain.
Inventors:
FURUKAWA NAOKI (JP)
MORIMOTO TSUYOSHI (JP)
YOKOTA HIROSHI (JP)
SANO ATSUKO (JP)
MORIMOTO TSUYOSHI (JP)
YOKOTA HIROSHI (JP)
SANO ATSUKO (JP)
Application Number:
PCT/JP2019/031733
Publication Date:
February 18, 2021
Filing Date:
August 09, 2019
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08L33/14; C08F220/26; C08K3/22; C09K5/06
Domestic Patent References:
| WO2018207876A1 | 2018-11-15 |
Foreign References:
| JP2004300424A | 2004-10-28 | |||
| JPH1180723A | 1999-03-26 | |||
| CN109504351A | 2019-03-22 | |||
| JP2019006864A | 2019-01-17 | |||
| JP2016075442A | 2016-05-12 | |||
| JP2016160148A | 2016-09-05 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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