Title:
RESIN COMPOSITION INCLUDING MALEIMIDE COPOLYMER AND CHLORINE-CONTAINING POLYMER, AND GUTTERS, GUTTER PARTS, JOINERY PROFILES, PIPES, AND JOINTS MOLDED FROM SAID RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/234816
Kind Code:
A1
Abstract:
Provided are: a resin composition including a maleimide copolymer and a chlorine-containing polymer, the resin composition making it possible to maintain prescribed mechanical properties while improving the heat resistance of a resin composition containing a chlorine-containing polymer, and furthermore having high improvement of the Vicat softening temperature per part by mass of the maleimide copolymer; and molded articles molded from the resin composition. The present invention provides a resin composition including, per 100 parts by mass of a chlorine-containing polymer, 5-100 parts by mass of a maleimide copolymer having a melt viscosity of 200-100,000 Pa·s as measured at a shear speed of 100/sec at 190°C, the maleimide copolymer having 40-90 mass% of aromatic vinyl monomer units, 0.5-30 mass% of vinyl cyanide monomer units, 0-10 mass% of unsaturated acid anhydride monomer units, and 5-30 mass% of maleimide monomer units, where the total of aromatic vinyl monomer units, vinyl cyanide monomer units, unsaturated acid anhydride monomer units, and maleimide monomer units is designated as 100 mass%, wherein the tensile strength of a molded article obtained from the resin composition as measured at 10 mm/min is 39.2 N/mm2 or greater.
Inventors:
MATSUBARA TATSUHIRO (JP)
NISHINO KOHEI (JP)
NISHINO KOHEI (JP)
Application Number:
PCT/JP2022/019315
Publication Date:
November 10, 2022
Filing Date:
April 28, 2022
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08F8/32; C08F212/10; C08F222/40; C08J5/18; C08K3/00; C08K3/013; C08K5/00; C08L25/12; C08L27/06; C08L35/00; C08L101/04; E06B1/26; E06B3/20; F16L9/12; F16L47/20
Domestic Patent References:
| WO2022039098A1 | 2022-02-24 | |||
| WO2022039099A1 | 2022-02-24 |
Foreign References:
| JPH02265944A | 1990-10-30 | |||
| JPH04122759A | 1992-04-23 | |||
| JPH11302482A | 1999-11-02 |
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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