Title:
RESIN COMPOSITION, RESIN COMPOSITION FOR INJECTION MOLDING, MOLDED ARTICLE AND HOUSING FOR ELECTRIC/ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/122582
Kind Code:
A1
Abstract:
Disclosed is a resin composition that has superior moldability, resistance to bleedout, resistance to sublimation and flame resistance, and provides a molded article having flame resistance as well as high levels of both impact strength and bending strength. Specifically disclosed is a resin composition containing a cellulose ester (A), a thermoplastic resin (B) having an aromatic ring on the main chain, a plasticizer (C) containing a polymer having repeated structural units and a number average molecular weight of 500 - 5000, and a phosphorus-containing flame retardant (D) with a molecular weight of 400 - 1500.
Inventors:
NORO MASAKI
INADA HIROSHI
INADA HIROSHI
Application Number:
PCT/JP2011/057696
Publication Date:
October 06, 2011
Filing Date:
March 28, 2011
Export Citation:
Assignee:
FUJIFILM CORP (JP)
NORO MASAKI
INADA HIROSHI
NORO MASAKI
INADA HIROSHI
International Classes:
C08L1/10; B29C45/00; C08K5/521; C08L27/12; C08L101/00; C08L101/02; G03G15/00
Foreign References:
| JP2006111858A | 2006-04-27 | |||
| JP2009046531A | 2009-03-05 | |||
| JP2009167253A | 2009-07-30 | |||
| JP2009179803A | 2009-08-13 | |||
| JP2005171193A | 2005-06-30 |
Attorney, Agent or Firm:
TAKAMATSU Takeshi et al. (JP)
Takamatsu 猛 (JP)
Takamatsu 猛 (JP)
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Claims: