Title:
RESIN COMPOSITION, INSULATION BODY FOR BUILD-UP PURPOSES WHICH COMPRISES SAID COMPOSITION, AND PREPREG PRODUCED USING SAID COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2013/051227
Kind Code:
A1
Abstract:
A resin composition characterized by comprising: an epoxy resin represented by formula (I); a phenolic resin represented by formula (II), which acts as a curing agent; and a polytetrafluoroethylene filler. In the formula, n represents an integer of 0 to 50, m represents an integer of 0 to 400, and A represents at least one bivalent group selected from a group (A) shown below.
Inventors:
TAKAHATA YOSHINORI (JP)
MORI TAKAHIRO (JP)
KASHIWAZAKI FUMITO (JP)
SAIO YOSHIHIDE (JP)
KIKUCHI TAKAAKI (JP)
MORI TAKAHIRO (JP)
KASHIWAZAKI FUMITO (JP)
SAIO YOSHIHIDE (JP)
KIKUCHI TAKAAKI (JP)
Application Number:
PCT/JP2012/006265
Publication Date:
April 11, 2013
Filing Date:
October 01, 2012
Export Citation:
Assignee:
ADEKA CORP (JP)
International Classes:
C08J5/24; C08G59/62; C08K5/5399; C08L27/18; C08L63/04
Domestic Patent References:
| WO2009096507A1 | 2009-08-06 |
Foreign References:
| JPH02120351A | 1990-05-08 | |||
| JP2003082061A | 2003-03-19 | |||
| JP2005336426A | 2005-12-08 | |||
| JP2011105803A | 2011-06-02 |
Attorney, Agent or Firm:
TAKITA, Seiki et al. (JP)
Seiki Takita (JP)
Seiki Takita (JP)
Download PDF:
Claims: