RESIN COMPOSITION AND LAMINATE IN WHICH SAME IS USED

Title:

RESIN COMPOSITION AND LAMINATE IN WHICH SAME IS USED

Document Type and Number:

WIPO Patent Application WO/2018/042995

Kind Code:

A1

Abstract:

[Problem] To provide: a resin composition that has exceptional adhesiveness with respect to bare copper, can maintain adhesiveness with respect to bare copper even when exposed to a high-temperature, high-humidity environment for an extended period of time, and conforms to a high-rated temperature standard or can obtain certification of said standard without a crosslinking step; and a laminate that can be suitably used as a coating material for a flexible flat cable, the resin composition being used in the laminate. [Solution] A resin composition for an adhesive layer of a laminate, the resin composition containing (A) 55-85% by mass of acid-modified polypropylene resin and (B) 15-45% by mass of a copolymer of ethylene and one or more comonomers selected from the group consisting of vinyl acetate, alkyl methacrylates, and alkyl acrylates, and being configured such that the sum of component (A) and component (B) is 100% by mass, and the acid-modification level of component (A) is 0.5-10 mol%.

Inventors:

ZENNYOJI YOSHIHIRO (JP)
INOMATA SAYURI (JP)

Application Number:

PCT/JP2017/027690

Publication Date:

March 08, 2018

Filing Date:

July 31, 2017

Export Citation:

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Assignee:

RIKEN TECHNOS CORP (JP)

International Classes:

C08L23/26; B32B27/28; B32B27/32; B32B27/36; C08L23/08; C09J123/08; C09J123/26; H01B7/08

Domestic Patent References:

WO2014010500A1	2014-01-16
WO2016181880A1	2016-11-17

Foreign References:

JPH09201913A	1997-08-05
JP2006124510A	2006-05-18
JP2009272083A	2009-11-19
JP2002184251A	2002-06-28
JP2002313151A	2002-10-25
JP2013254703A	2013-12-19
JP2015201312A	2015-11-12

Other References: