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Title:
RESIN COMPOSITION FOR LASER MARKING
Document Type and Number:
WIPO Patent Application WO/2024/053429
Kind Code:
A1
Abstract:
The present invention provides a resin composition for laser marking that can yield characters/symbols having sharp contrast while having high strength and rigidity, and has excellent laser marking properties on electrical/electronic parts, mechanical parts, automobile parts, etc. This resin composition for laser marking contains 20-70 mass% of a thermoplastic resin (A), 20-70 mass% of a glass fiber (B), and 0.1-10 mass% of potassium titanate (C). The thermoplastic resin (A) is preferably polyamide.

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Inventors:
TAKITA MOTONORI (JP)
YOSHIMURA NOBUHIRO (JP)
Application Number:
PCT/JP2023/030729
Publication Date:
March 14, 2024
Filing Date:
August 25, 2023
Export Citation:
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Assignee:
TOYOBO MC CORP (JP)
International Classes:
C08K7/14; B41M5/26; C08K3/013; C08K3/24; C08L77/00; C08L101/00
Foreign References:
JPH05179012A1993-07-20
JP2007098939A2007-04-19
JPH0542760A1993-02-23
Attorney, Agent or Firm:
KAZAHAYA, Nobuaki et al. (JP)
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