Title:
RESIN COMPOSITION, LAYERED PRODUCT, SEMICONDUCTOR CHIP WITH RESIN COMPOSITION LAYER, SUBSTRATE ON WHICH SEMICONDUCTOR CHIP WITH RESIN COMPOSITION LAYER IS TO BE MOUNTED, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/063282
Kind Code:
A1
Abstract:
Provided is a resin composition comprising an amino triazine novolac resin (A), at least one compound (B) selected from the group consisting of a maleimide compound (BA) and a citraconimide compound (BB), and an inorganic filler (D), in which the inorganic filler (D) comprises an inorganic filler (D1) having at least one functional group (d) selected from the group consisting of a (meth)acryl group, a vinyl group, a styryl group and a phenyl group, the compound (B) comprises a compound (B1) and a compound (B2), the compound (B1) comprises at least one compound selected from the group consisting of a maleimide compound (BA-1) having a weight average molecular weight of 3,000 to 9,500 inclusive and a citraconimide compound (BB-1) having a weight average molecular weight of 3,000 to 9,500 inclusive, the compound (B2) comprises at least one compound selected from the group consisting of a maleimide compound (BA-2) having a weight average molecular weight of 300 or more and less than 3,000 and a citraconimide compound (BB-2) having a weight average molecular weight of 300 or more and less than 3,000, and each of the weight average molecular weights is a value determined in terms of an equivalent polystyrene molecular weight by a gel permeation chromatography method.
Inventors:
KAMEI TAKAYUKI (JP)
IHARA KATSUTOSHI (JP)
SUGIYAMA GENKI (JP)
TAKANO KENTARO (JP)
KIDA TSUYOSHI (JP)
IHARA KATSUTOSHI (JP)
SUGIYAMA GENKI (JP)
TAKANO KENTARO (JP)
KIDA TSUYOSHI (JP)
Application Number:
PCT/JP2022/037765
Publication Date:
April 20, 2023
Filing Date:
October 11, 2022
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L61/30; B32B27/42; C08F271/02; C08K3/013; C08K5/3415; C08K9/06; C08L39/00; C08L93/04; H01L23/29; H01L23/31
Domestic Patent References:
| WO2016117237A1 | 2016-07-28 | |||
| WO2011126070A1 | 2011-10-13 | |||
| WO2011108524A1 | 2011-09-09 |
Foreign References:
| JP2016222838A | 2016-12-28 | |||
| US20150065608A1 | 2015-03-05 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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