Title:
RESIN COMPOSITION FOR METAL SUBSTRATE, RESIN GLUE SOLUTION COMPRISING SAME, AND METAL-BASED COPPER FOIL-CLAD LAMINATE
Document Type and Number:
WIPO Patent Application WO/2020/215399
Kind Code:
A1
Abstract:
Disclosed are a resin composition for a metal substrate, a resin glue solution comprising same, and a metal-based copper foil-clad laminate. The resin composition comprises the following components based on 100% of the total weight of the resin composition: 5-40% of a main resin and 60-95% of a thermally conductive filler; and the main resin comprises 60-90% of a flexible epoxy resin and 10-40% of a phenoxy resin based on 100% of the total weight of the resin composition, wherein the flexible epoxy resin has a structure as represented by formula I. The resin composition has a low modulus, wherein same can alleviate the stress generated by the impact of heat and cold, and can withstand more than 1000 cycles of hot and cold cycle experiments.
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Inventors:
SHE NAIDONG (CN)
HUANG ZENGBIAO (CN)
HUANG ZENGBIAO (CN)
Application Number:
PCT/CN2019/086833
Publication Date:
October 29, 2020
Filing Date:
May 14, 2019
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L63/00; C08K3/04; C08K3/22; C08K3/28
Foreign References:
| CN101974208A | 2011-02-16 | |||
| CN107849351A | 2018-03-27 | |||
| JP2013194094A | 2013-09-30 | |||
| JP2016155946A | 2016-09-01 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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