Title:
RESIN COMPOSITION, METHOD FOR FORMING CURED PRODUCT, AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2021/039380
Kind Code:
A1
Abstract:
Provided are: a resin composition that contains copper particles and a specific resin, and is capable of producing a cured product having a low volume resistance value; and a cured product obtained by curing the resin composition. Said resin composition contains: (A) copper particles having an average particle size of 0.1-20 μm; (B) a phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (b1) with an epoxy compound (b2); and (C) a hardener, wherein the content of the component (B) is 0.1-30 parts by mass and the content of the component (C) is 0.1-5 parts by mass, with respect to 100 parts by mass of the total amount of the components (A) to (C). Furthermore, said cured product is obtained by curing the resin composition.
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Inventors:
NUIDA YUSUKE (JP)
HOSOKAWA HITOSHI (JP)
MORITA HIROSHI (JP)
HOSOKAWA HITOSHI (JP)
MORITA HIROSHI (JP)
Application Number:
PCT/JP2020/030596
Publication Date:
March 04, 2021
Filing Date:
August 11, 2020
Export Citation:
Assignee:
ADEKA CORP (JP)
International Classes:
C08G59/14; C08K3/08; C08L63/00
Foreign References:
| JP2017110183A | 2017-06-22 | |||
| JP2019073622A | 2019-05-16 |
Attorney, Agent or Firm:
KONDO Rieko et al. (JP)
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