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Patent Searching and Data


Title:
RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/276093
Kind Code:
A1
Abstract:
A resin composition comprising at least one resin selected from the group consisting of polyamides, poly(amide-imide)s, polyimides, and poly(amic acid)s, at least one solvent A having a lactone structure, and at least one solvent B compatible with the solvent A, wherein the solvent B, after having been stored for 3 hours in an environment of 30°C and 60% RH, has a water content of 2 mass% or less.

Inventors:
SATO MIZUKI (JP)
HASHIMOTO GAKU (JP)
SATO EIICHI (JP)
Application Number:
PCT/JP2021/024883
Publication Date:
January 05, 2023
Filing Date:
June 30, 2021
Export Citation:
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Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08L77/00; C08L79/08
Domestic Patent References:
WO2012133415A12012-10-04
WO2013047451A12013-04-04
WO2016129506A12016-08-18
WO2018062296A12018-04-05
WO2019189483A12019-10-03
WO2021045004A12021-03-11
Foreign References:
JPH10330449A1998-12-15
JP2017036407A2017-02-16
JP2012062355A2012-03-29
JP2016191932A2016-11-10
JP2016029126A2016-03-03
JP2021014564A2021-02-12
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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