Title:
RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/276093
Kind Code:
A1
Abstract:
A resin composition comprising at least one resin selected from the group consisting of polyamides, poly(amide-imide)s, polyimides, and poly(amic acid)s, at least one solvent A having a lactone structure, and at least one solvent B compatible with the solvent A, wherein the solvent B, after having been stored for 3 hours in an environment of 30°C and 60% RH, has a water content of 2 mass% or less.
Inventors:
SATO MIZUKI (JP)
HASHIMOTO GAKU (JP)
SATO EIICHI (JP)
HASHIMOTO GAKU (JP)
SATO EIICHI (JP)
Application Number:
PCT/JP2021/024883
Publication Date:
January 05, 2023
Filing Date:
June 30, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08L77/00; C08L79/08
Domestic Patent References:
WO2012133415A1 | 2012-10-04 | |||
WO2013047451A1 | 2013-04-04 | |||
WO2016129506A1 | 2016-08-18 | |||
WO2018062296A1 | 2018-04-05 | |||
WO2019189483A1 | 2019-10-03 | |||
WO2021045004A1 | 2021-03-11 |
Foreign References:
JPH10330449A | 1998-12-15 | |||
JP2017036407A | 2017-02-16 | |||
JP2012062355A | 2012-03-29 | |||
JP2016191932A | 2016-11-10 | |||
JP2016029126A | 2016-03-03 | |||
JP2021014564A | 2021-02-12 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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