Title:
RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION, AND STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/163921
Kind Code:
A1
Abstract:
Provided are: an anisotropic conductive adhesive in which conductive particles are able to be dispersed by a simple method, and which is capable of suppressing short-circuit between electrode terminals of an electronic component; a method for producing an anisotropic conductive adhesive; and a connection structure. An anisotropic conductive adhesive according to the present invention contains: covered conductive particles, each of which is obtained by covering a part of the surface of a conductive particle with an insulating filler; an insulating filler; and an insulating binder. The covered conductive particles are dispersed in the insulating binder; each one of the conductive particles has a particle diameter of 7 μm or more; the particle diameter of the insulating filler is 0.02-0.143% of the particle diameters of the conductive particles; and the amount of the insulating filler relative to the conductive particles is 0.78-77% by volume.
Inventors:
TANAKA YUSUKE (JP)
SATO SHINICHI (JP)
SATO SHINICHI (JP)
Application Number:
PCT/JP2018/007377
Publication Date:
September 13, 2018
Filing Date:
February 27, 2018
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
C08L101/00; C08K3/36; C09J7/00; C09J9/02; C09J11/04; C09J201/00; H01B1/20
Domestic Patent References:
| WO2014088095A1 | 2014-06-12 | |||
| WO2011052614A1 | 2011-05-05 | |||
| WO2016101982A1 | 2016-06-30 |
Foreign References:
| JP2002363383A | 2002-12-18 | |||
| JP2002186076A | 2002-06-28 | |||
| JP2013175453A | 2013-09-05 | |||
| JP2015160861A | 2015-09-07 |
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro (JP)
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