Title:
RESIN COMPOSITION, MOLDED ARTICLE, AND METHOD FOR PRODUCING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/075656
Kind Code:
A1
Abstract:
Provided is a resin composition comprising: a vinyl chloride-based resin; and a plurality of particles having a glass transition point or a melting point greater than the glass transition point of the vinyl chloride-based resin. The plurality of particles include: a first particle group having an average primary particle diameter of less than 0.7 μm, as determined by an image analyzing method; and a second particle group having an average primary particle diameter of 0.7 μm or more and less than 3 μm, as determined by an image analyzing method. The resin composition includes the first particle group and the second particle group at 80 parts by mass to 300 parts by mass with respect to 100 parts by mass of the vinyl chloride-based resin. The mass ratio of the first particle group and the second particle group is 20:80 to 99:1.
Inventors:
KAWABATA TOSHIKI (JP)
Application Number:
PCT/JP2023/035733
Publication Date:
April 11, 2024
Filing Date:
September 29, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L27/06; C08J5/18; C08K3/013; C08K3/26; C08L7/00; C08L9/00; C08L23/00; C08L23/28; C08L101/00
Attorney, Agent or Firm:
RYUKA & PARTNERS (JP)
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