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Patent Searching and Data


Title:
RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2012/157602
Kind Code:
A1
Abstract:
Provided is a cellulose acetate resin composition that contains a cellulose acetate ether compound and a stabilizer comprising at least one compound selected from a group consisting of a phosphite compound, a hindered phenol compound, a hindered amine compound and a sulfur compound. The cellulose acetate ether compound is a compound in which a specific atomic group has been introduced into cellulose acetate via an ether group derived from a hydroxyl group, the specific atomic group being introduced into cellulose acetate, which has a degree of residual hydroxyl group substitution of 0.3 to 1.0, at a degree of substitution of 0.01 or higher via an ether group derived from a hydroxyl group in the cellulose acetate.

Inventors:
SAWAI DAISUKE (JP)
NAGAI TAKAYASU (JP)
INADA HIROSHI (JP)
TAMURA AKIO (JP)
Application Number:
PCT/JP2012/062283
Publication Date:
November 22, 2012
Filing Date:
May 14, 2012
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
SAWAI DAISUKE (JP)
NAGAI TAKAYASU (JP)
INADA HIROSHI (JP)
TAMURA AKIO (JP)
International Classes:
C08L1/32; C08K5/13; C08K5/36; C08K5/524; C08L27/12; C08L69/00
Domestic Patent References:
WO2011019064A12011-02-17
Foreign References:
JP2002020410A2002-01-23
JP2000007829A2000-01-11
JP2006328298A2006-12-07
JP2006249221A2006-09-21
JP2010241848A2010-10-28
Attorney, Agent or Firm:
IIDA, Toshizo et al. (JP)
Toshizo Iida (JP)
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Claims: