Title:
RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2024/038765
Kind Code:
A1
Abstract:
The present invention provides a resin composition which contains a thermoplastic resin, an inorganic material powder, and a hydrogenated styrene-based thermoplastic elastomer, wherein: the mass ratio of the thermoplastic resin to the inorganic material powder is 10:90 to 50:50; the thermoplastic resin is composed of a modified polyphenylene ether; and the content of the hydrogenated styrene-based thermoplastic elastomer is 5.0% by mass to 20.0% by mass relative to the resin composition.
Inventors:
DOHI AKIHITO (JP)
YAMASHITA YUKA (JP)
YAMASHITA YUKA (JP)
Application Number:
PCT/JP2023/028338
Publication Date:
February 22, 2024
Filing Date:
August 02, 2023
Export Citation:
Assignee:
TBM CO LTD (JP)
International Classes:
C08L71/12; C08K3/013; C08K3/26; C08K9/04; C08L25/04; C08L53/02
Domestic Patent References:
| WO2020235006A1 | 2020-11-26 |
Foreign References:
| JP2012131977A | 2012-07-12 | |||
| JP2003034760A | 2003-02-07 |
Attorney, Agent or Firm:
WASHIDA & ASSOCIATES (JP)
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