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Title:
RESIN COMPOSITION, MOLDED BODY, AND FILM
Document Type and Number:
WIPO Patent Application WO/2023/132310
Kind Code:
A1
Abstract:
This resin composition contains a polyamide-imide and an acrylic resin. The polyamide-imide has diamine-derived structures, tetracarboxylic-acid-dianhydride-derived structures, and dicarboxylic-acid-derived structures. The diamine-derived structures include structures derived from fluoroalkyl-substituted benzidines. In the polyamide-imide, the proportion of dicarboxylic-acid-derived structures may be 5-80 mol% relative to the total of tetracarboxylic-acid-dianhydride-derived structures and dicarboxylic-acid-derived structures. The resin composition is suited to the production of molded bodies such as films.

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Inventors:
OGAWA KOHEI (JP)
ISHIGURO FUMIYASU (JP)
Application Number:
PCT/JP2022/048340
Publication Date:
July 13, 2023
Filing Date:
December 27, 2022
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
C08L79/08; C08G73/10; C08G73/14; C08L33/00; C08L33/14
Domestic Patent References:
WO2020138045A12020-07-02
WO2018079474A12018-05-03
Foreign References:
JP2021172087A2021-11-01
JP2020002325A2020-01-09
JP2014070187A2014-04-21
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
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