RESIN COMPOSITION, MOLDED BODY USING SAME AND METHOD FOR PRODUCING RESIN COMPOSITION

Title:

RESIN COMPOSITION, MOLDED BODY USING SAME AND METHOD FOR PRODUCING RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2022/239716

Kind Code:

A1

Abstract:

A resin composition which contains a resin (A) containing 30% by mole or more of a structural unit that is represented by formula (1), and a boron compound (B), wherein the elemental boron contained in the boron compound (B) is 0.01 to 2,000 micromoles relative to 1 g of the resin (A).

Inventors:

SUNAGA SHUICHI (JP)
MATSUSHITA YUTA (JP)
LU WENJIE (JP)

Application Number:

PCT/JP2022/019618

Publication Date:

November 17, 2022

Filing Date:

May 09, 2022

Export Citation:

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Assignee:

KURARAY CO (JP)

International Classes:

C08L29/02; B32B27/30; B65D65/40; C08F8/04; C08K3/38

Domestic Patent References:

WO2017209212A1

2017-12-07

Foreign References:

JPH10272738A	1998-10-13
JP2006188643A	2006-07-20