Title:
RESIN COMPOSITION AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2017/154816
Kind Code:
A1
Abstract:
Provided is a molded body of a resin composition, which has improved easy wiping-off properties and scratch resistance. This resin composition contains (1) a thermoplastic resin and (2) a fluorine-containing copolymer; and the fluorine-containing copolymer (2) is a copolymer which comprises (a) a repeating unit formed from a fluorine-containing monomer represented by formula CH2=C(-X)-C(=O)-Y-Z-Rf, and (b) a repeating unit formed from a non-fluorine monomer having a hydrocarbon group with 14 or more carbon atoms, and which has a weight average molecular weight of 2,500-20,000.
Inventors:
SAKAMI KAZUKI (JP)
MASUDA EIJI (JP)
KAWAHARA KAZUYA (JP)
MASUDA EIJI (JP)
KAWAHARA KAZUYA (JP)
Application Number:
PCT/JP2017/008704
Publication Date:
September 14, 2017
Filing Date:
March 06, 2017
Export Citation:
Assignee:
DAIKIN IND LTD (JP)
International Classes:
C08L101/12; C08F20/22; C08L33/16
Domestic Patent References:
WO2010047258A1 | 2010-04-29 | |||
WO2015080060A1 | 2015-06-04 | |||
WO2008153075A1 | 2008-12-18 | |||
WO2016000829A1 | 2016-01-07 |
Foreign References:
JPH037745A | 1991-01-14 | |||
JP2015214640A | 2015-12-03 | |||
JP2003253077A | 2003-09-10 | |||
JPH06293705A | 1994-10-21 | |||
JPH06183946A | 1994-07-05 | |||
JPH06183947A | 1994-07-05 |
Other References:
See also references of EP 3428235A4
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
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