Title:
RESIN COMPOSITION AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2022/158511
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a resin composition which can be easily molded and processed, gives an impression of flexibility and weight, and is formed from thermoplastic resin and an inorganic filler material, and to provide a molded body. This resin composition contains 15-50 parts by mass of (A) a specific 4-methyl-1-pentene / α-olefin copolymer, 10-50 parts by mass of (B) an inorganic filler material and 5-49 parts by mass of (C) thermoplastic elastomers (the total of the 4-methyl-1-pentene / α-olefin copolymer, the inorganic filler material and the thermoplastic elastomers is defined as 100 parts by mass), wherein the thermoplastic elastomer (C) is at least one type selected from the group consisting of olefin-base thermoplastic elastomers (C1) and styrene-based thermoplastic elastomers (C2). This molded body is formed from the aforementioned resin composition.
Inventors:
FUKAGAWA YOSHISADA (JP)
UEKUSA TAKAYUKI (JP)
YASUI MOTOYASU (JP)
UEKUSA TAKAYUKI (JP)
YASUI MOTOYASU (JP)
Application Number:
PCT/JP2022/001920
Publication Date:
July 28, 2022
Filing Date:
January 20, 2022
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08F210/14; C08K3/013; C08K3/22; C08K3/26; C08K3/30; C08K3/34; C08L23/16; C08L23/20; C08L53/02
Domestic Patent References:
| WO2016143599A1 | 2016-09-15 | |||
| WO2021095683A1 | 2021-05-20 | |||
| WO2018092494A1 | 2018-05-24 | |||
| WO2001053369A1 | 2001-07-26 | |||
| WO2001027124A1 | 2001-04-19 | |||
| WO2011055803A1 | 2011-05-12 | |||
| WO2014050817A1 | 2014-04-03 |
Foreign References:
| JP2020075947A | 2020-05-21 | |||
| JP2018135415A | 2018-08-30 | |||
| JP2019130707A | 2019-08-08 | |||
| JP2019033798A | 2019-03-07 | |||
| JP2019125922A | 2019-07-25 | |||
| JP2001071378A | 2001-03-21 | |||
| JP2003026866A | 2003-01-29 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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