Title:
RESIN COMPOSITION, MOLDED OBJECT, COMPOSITE, AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/085421
Kind Code:
A1
Abstract:
Provided are: a resin composition which can be reduced in HF gas evolution when molded with heating, has excellent heat resistance, and does not take a color; a molded object obtained by molding the resin composition with heating; and a composite including the molded object and a use of these. The resin composition comprises a fluoropolymer, a nonfluorinated thermoplastic resin, and an inorganic compound, wherein the inorganic compound has an average particle diameter D50 less than 4.5 μm and contains neither a carbon atom nor a hydrogen atom. The molded object is obtained by molding the resin composition with heating.
Inventors:
ABE MASATOSHI (JP)
SASAKI TORU (JP)
NISHI MAI (JP)
YODOGAWA MASAHIDE (JP)
SASAKI TORU (JP)
NISHI MAI (JP)
YODOGAWA MASAHIDE (JP)
Application Number:
PCT/JP2022/042199
Publication Date:
May 19, 2023
Filing Date:
November 14, 2022
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
C08L101/00; C08K3/013; C08K3/22; C08L27/12; C08L71/10
Domestic Patent References:
| WO2017115812A1 | 2017-07-06 | |||
| WO2021117531A1 | 2021-06-17 | |||
| WO2018066584A1 | 2018-04-12 |
Foreign References:
| JP2002121347A | 2002-04-23 |
Attorney, Agent or Firm:
T.S. PARTNERS et al. (JP)
Download PDF: