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Title:
RESIN COMPOSITION AND MOLDED OBJECT OBTAINED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2016/158332
Kind Code:
A1
Abstract:
According to an embodiment, a resin composition comprising a polymer (A) comprising 45 mass% or more (meth)acrylate units (a) represented by the following formula (1), a polymer (B) comprising 60 mass% or more methyl (meth)acrylate units (b) and having a mass-average molecular weight of 5,000-20,000, and a polycarbonate-based resin (C) is provided.

Inventors:
KOUNO KAZUKI (JP)
KUWAHARA HISAYUKI (JP)
Application Number:
PCT/JP2016/057887
Publication Date:
October 06, 2016
Filing Date:
March 14, 2016
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L33/08; C08L69/00
Domestic Patent References:
WO2013136410A12013-09-19
WO2012157324A12012-11-22
Foreign References:
JP2015042735A2015-03-05
JP2014065901A2014-04-17
JP2014210892A2014-11-13
JP2013067793A2013-04-18
JP2012236871A2012-12-06
JPH0925438A1997-01-28
Other References:
See also references of EP 3279259A4
Attorney, Agent or Firm:
KOBAYASHI Hiroshi et al. (JP)
Kobayashi 浩 (JP)
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