RESIN COMPOSITION, AND MOLDED PRODUCT, CURED PRODUCT, FILM, COMPOSITE MATERIAL, CURED COMPOSITE MATERIAL, LAMINATE, METAL FOIL WITH RESIN, AND VARNISH FOR CIRCUIT BOARD MATERIAL OBTAINED THEREFROM

WIPO Patent Application WO/2023/145935

A1

Provided is a resin composition which exhibits excellent dielectric properties and adhesive properties after being cured, and which can be used in a dielectric material, an insulating material, and an adhesive material in fields such as electrical and electronic industries and aerospace industries. The resin composition contains, at a specific mixing ratio: (A) a functional group-modified vinyl aromatic copolymer containing a structural unit (a) which is derived from a divinyl aromatic compound and of which at least 95 mol% is a crosslinked structural unit (a1) represented by structural formula (1), where R1 represents an aromatic hydrocarbon group having 6 to 30 carbon atoms, and a structural unit (b) derived from a monovinyl aromatic compound, wherein the functional group-modified vinyl aromatic copolymer is modified by at least one functional group selected from the group consisting of an amino group, an alkoxy silyl group, and a hydroxy group, and has an average functional group per molecule of at least 1.5, and a number average molecular weight Mn of 500-30,000; and (B) a curable reactive resin and/or (C) a thermoplastic resin.

KAWABE MASANAO (JP)
KURATOMI TADASHI (JP)

PCT/JP2023/002872

August 03, 2023

January 30, 2023

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NIPPON STEEL CHEMICAL & MAT CO LTD (JP)

C08L25/10; B32B27/32; C08C19/22; C08C19/25; C08J5/18; C08L101/00

WO2020262371A1	2020-12-30
WO2020067336A1	2020-04-02

JP2019178310A	2019-10-17
JPH11335433A	1999-12-07
JP2013155268A	2013-08-15

SASAKI Kazuya et al. (JP)

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