Title:
RESIN COMPOSITION, MOLDING, AND METHOD FOR PRODUCING MOLDING
Document Type and Number:
WIPO Patent Application WO/2019/087261
Kind Code:
A1
Abstract:
This resin composition for injection molding contains a curable component and a filler having an average particle diameter not exceeding 30 µm. The resin composition for injection molding may also be used for coil molding. The molding is equipped with a coil and a sealing portion that seals the coil, and the sealing portion contains the resin composition or a cured product thereof.
Inventors:
KAWABATA YASUNORI (JP)
FUKUHARA TATSUHITO (JP)
NAKAMURA KASUMI (JP)
IWAYA TAKAHIDE (JP)
KOBAYASHI KUNIYUKI (JP)
KIMURA NAOHIRO (JP)
FUKUHARA TATSUHITO (JP)
NAKAMURA KASUMI (JP)
IWAYA TAKAHIDE (JP)
KOBAYASHI KUNIYUKI (JP)
KIMURA NAOHIRO (JP)
Application Number:
PCT/JP2017/039167
Publication Date:
May 09, 2019
Filing Date:
October 30, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08L101/00; H01F27/32
Foreign References:
| JP2015044906A | 2015-03-12 | |||
| JP2008195782A | 2008-08-28 | |||
| JP2004051824A | 2004-02-19 | |||
| JP2001261940A | 2001-09-26 | |||
| JP2009073933A | 2009-04-09 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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