Title:
RESIN COMPOSITION, MULTILAYER SHEET, PREPREG, CURED PRODUCT, SUBSTRATE WITH CURED PRODUCT, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/127523
Kind Code:
A1
Abstract:
The present invention provides a resin composition which has substrate processing adequacy including embeddability into substrate relief patterns, heat cycle resistance and plating solution resistance, and which enables the achievement of a cured product that has excellent long-term heat resistance and excellent bending strength. The above is achieved by means of a resin composition which contains a polyimide resin (A), a curable compound (B) and a thermally conductive filler (C), wherein: a cured product of this resin composition has a Tg of 140°C to 400°C; the polyimide resin (A) has a residue X2d that is derived from a dimer diamine and/or a dimer diisocyanate, while having a total average number of functional groups selected from among an amino group, an acid anhydride group and a maleimide group of 1 or less (including 0); the temperature and Mw at which the storage elastic modulus G' of the polyimide resin (A) is 1.0 × 107 Pa are within specific ranges; and the curable compound (B) is selected from the group consisting of an epoxy compound (b1) and the like.
Inventors:
SAKAGUCHI GO (JP)
SONETA YUJI (JP)
USA YUKI (JP)
SONETA YUJI (JP)
USA YUKI (JP)
Application Number:
PCT/JP2022/046199
Publication Date:
July 06, 2023
Filing Date:
December 15, 2022
Export Citation:
Assignee:
TOYO INK SC HOLDINGS CO LTD (JP)
TOYOCHEM CO LTD (JP)
TOYOCHEM CO LTD (JP)
International Classes:
C08L79/08; B32B27/20; B32B27/34; C08F283/04; C08G18/64; C08G59/20; C08G59/62; C08G65/38; C08G73/10; C08J5/24; C08K3/013; C08K5/00; C08K5/04; C08K5/1515; C08K5/29; C08K5/3415; C08K5/3417
Domestic Patent References:
| WO2019188436A1 | 2019-10-03 |
Foreign References:
| JP2020132881A | 2020-08-31 | |||
| JP6391851B2 | 2018-09-19 | |||
| JP2015117278A | 2015-06-25 | |||
| JP6981522B1 | 2021-12-15 | |||
| JP2021070824A | 2021-05-06 | |||
| JP2019119755A | 2019-07-22 | |||
| JP2022054337A | 2022-04-06 |
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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