RESIN COMPOSITION AND MULTILAYER STRUCTURE INCLUDING THE SAME

Title:

RESIN COMPOSITION AND MULTILAYER STRUCTURE INCLUDING THE SAME

Document Type and Number:

WIPO Patent Application WO/2004/000934

Kind Code:

A1

Abstract:

A resin composition comprising (A) a saponified ethylene/vinyl acetate copolymer and (B) a substituted 9,10-anthraquinone having a percentage weight loss through 60-minute standing at 250°C of 5% or less and having a substituent in at least one of the 2, 3, 6, and 7-positions; and a multilayer structure containing the resin composition as an interlayer. The multilayer structure is excellent not only in appearance and oxygen-barrier properties but in molding stability, pinhole-free properties, interlaminar adhesion, etc. It is useful in the packaging of foods such as meat, ketchup, miso, beer, etc.

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Inventors:

INOUE KAORU (JP)
MORIYAMA TAKAMASA (JP)

Application Number:

PCT/JP2003/007978

Publication Date:

December 31, 2003

Filing Date:

June 24, 2003

Export Citation:

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Assignee:

NIPPON SYNTHETIC CHEM IND (JP)
INOUE KAORU (JP)
MORIYAMA TAKAMASA (JP)
YAMAMOTO TAKEO (JP)

International Classes:

B32B27/28; B32B27/08; B32B27/30; C08K5/08; C08L23/08; C08L29/04; C08L51/00; C08L51/06; C08L53/00; C08K5/07; C08K5/42; (IPC1-7): C08L29/04; B32B27/28; C08J3/20; C08K5/08

Foreign References:

JP2002248717A	2002-09-03
JPS579574B2	1982-02-22
JPH09159826A	1997-06-20

Attorney, Agent or Firm:

Takashima, Hajime (1-1 Fushimimachi 4-chome, Chuo-k, Osaka-shi Osaka, JP)

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