Title:
RESIN COMPOSITION AND MULTILAYERED LAMINATE
Document Type and Number:
WIPO Patent Application WO/1993/011192
Kind Code:
A1
Abstract:
A resin composition comprising at least one component selected from the group consisting of (A) an ethylenic multicomponent copolymer, such as an ethylene/maleic anhydride/methyl methacrylate terpolymer, (B) a polyolefinic resin, such as low-density polyethylene, (C) a metal salt of an organic carboxylic acid, such as ionomer, and (D) a copolymeric nylon, such as a nylon 6/66/12 copolymer, and a multilayered laminate wherein the adhesive layer comprises the above composition. This composition is a hot-melt adhesive resin composition and excellent in adhesion to a wide variety of base materials. Especially when the composition contains the component (B) or (C), it is suitable for making a multilayered laminate to be used as the material of automotive interior furnishings. When it contains the component (D), it has an excellent adhesion to base materials to which no sufficient adhesion has been possible.
Inventors:
TSUTSUMI KATSUAKI (JP)
TERASAWA TAKEO (JP)
TAGOSHI HIROTAKA (JP)
INAZAWA SHINTARO (JP)
IKENAGA YOSHINORI (JP)
NAGAOKA TAKASHI (JP)
TERASAWA TAKEO (JP)
TAGOSHI HIROTAKA (JP)
INAZAWA SHINTARO (JP)
IKENAGA YOSHINORI (JP)
NAGAOKA TAKASHI (JP)
Application Number:
PCT/JP1992/001531
Publication Date:
June 10, 1993
Filing Date:
November 24, 1992
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
B32B7/10; B32B27/12; B32B27/28; B32B27/32; B60R13/00; C08K5/09; C08K5/098; B32B7/04; C08L23/00; C08L23/02; C08L23/06; C08L23/08; C08L77/00; C08L77/02; C08L77/06; C09J123/08; C09J177/00; (IPC1-7): B32B27/32; B32B27/34; C08K5/09; C08L23/02; C08L23/08; C08L53/00; C08L77/00
Foreign References:
| JPH01103662A | 1989-04-20 | |||
| JPS62241941A | 1987-10-22 | |||
| JPS62241938A | 1987-10-22 |
Other References:
See also references of EP 0568707A4
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