RESIN COMPOSITION AND ELECTRICAL/ELECTRONIC PART ENCAPSULATION BODY

Title:

RESIN COMPOSITION AND ELECTRICAL/ELECTRONIC PART ENCAPSULATION BODY

Document Type and Number:

WIPO Patent Application WO/2022/158384

Kind Code:

A1

Abstract:

[Problem] To provide a resin composition for an electrical/electronic encapsulation, the composition having excellent oil resistance and insulation performance without a reduction in fluidity. [Solution] Provided is a resin composition that contains a polyester resin (A) having a solubility parameter (SP) value of 10.0 (cal/cm3)1/2 or greater, a dimer acid polyamide (B), and an epoxy resin (C).

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Inventors:

MURAKAMI YUKI (JP)
HAMASAKI RYO (JP)

Application Number:

PCT/JP2022/001088

Publication Date:

July 28, 2022

Filing Date:

January 14, 2022

Export Citation:

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Assignee:

TOYO BOSEKI (JP)

International Classes:

H01L23/29; C08L63/00; C08L67/03; C08L77/08; H01L23/31

Foreign References:

JP2004083918A	2004-03-18
JP2004277559A	2004-10-07
JP2012180385A	2012-09-20
JP2013060539A	2013-04-04
JP2014074157A	2014-04-24

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