Title:
RESIN COMPOSITION FOR PATTERN FORMATION, AND RESIN MOLDED ARTICLE HAVING PATTERN AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2013/047312
Kind Code:
A1
Abstract:
Provided is a resin composition for pattern formation, which comprises a polyphenylene ether resin and a polystyrene resin, and which can be used for producing a resin molded article having a pattern by molding the resin composition together with a thermoplastic resin having a molding processing temperature of 170-250˚C.
Inventors:
HAMAHIRA EIZO (JP)
HORIKAWA GEN (JP)
KIMURA MASAYA (JP)
HORIKAWA GEN (JP)
KIMURA MASAYA (JP)
Application Number:
PCT/JP2012/074027
Publication Date:
April 04, 2013
Filing Date:
September 20, 2012
Export Citation:
Assignee:
NAGASE & CO LTD (JP)
International Classes:
C08L51/04; C08L25/06; C08L71/12
Foreign References:
| JPH08208919A | 1996-08-13 | |||
| JP2002194223A | 2002-07-10 | |||
| JPH0680821A | 1994-03-22 | |||
| JPH03200841A | 1991-09-02 | |||
| JP2000239466A | 2000-09-05 | |||
| JP2000239432A | 2000-09-05 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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Claims:
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