Title:
RESIN COMPOSITION FOR PHOTOIMPRINTING, PATTERNING METHOD AND ETCHING MASK
Document Type and Number:
WIPO Patent Application WO/2012/096071
Kind Code:
A1
Abstract:
Provided is a resin composition for photoimprinting, the cured products of which have superior etch resistance and heat resistance, and a patterning method using same. A resin composition for photoimprinting comprising a photocurable monomer (A), a photocurable monomer (B), and a photopolymerization initiator (C), wherein the photocurable monomer (A) is at least one kind of carbazole compound represented by formula (1), the photocurable monomer (B) contains at least one of the compounds represented by formulas (2), (3) and (4), and the weight ratio of the photocurable monomer (A) to the photocurable monomer (B) (weight of photocurable monomer (A)/weight of photocurable monomer (B)) is 30/70 - 87/13. Formula (1): (R1 represents -CH=CH2, etc. and R2 and R3 represent hydrogen, etc.) Formula (2): (R4 and R5 represent -O-CH=CH2, etc. and R6 and R7 represent hydrogen, etc.) Formula (3): (X is -O-CH=CH2, etc. and A1 - A4 are hydrogen atoms, etc. m, n and o represent 0 or 1.) Formula (4): (R8 and R9 represent -O-CH=CH2, etc. and p represents an integer of 0 or more.)
Inventors:
HAYASHIDA YOSHIHISA (JP)
SATSUKA TAKURO (JP)
IKEDA TERUYO (JP)
FUTAESAKU NORIO (JP)
TAKEMORI TOSHIFUMI (JP)
SATSUKA TAKURO (JP)
IKEDA TERUYO (JP)
FUTAESAKU NORIO (JP)
TAKEMORI TOSHIFUMI (JP)
Application Number:
PCT/JP2011/077988
Publication Date:
July 19, 2012
Filing Date:
December 02, 2011
Export Citation:
Assignee:
MARUZEN PETROCHEM CO LTD (JP)
HAYASHIDA YOSHIHISA (JP)
SATSUKA TAKURO (JP)
IKEDA TERUYO (JP)
FUTAESAKU NORIO (JP)
TAKEMORI TOSHIFUMI (JP)
HAYASHIDA YOSHIHISA (JP)
SATSUKA TAKURO (JP)
IKEDA TERUYO (JP)
FUTAESAKU NORIO (JP)
TAKEMORI TOSHIFUMI (JP)
International Classes:
C08F2/50; C08F271/02; H01L21/027
Domestic Patent References:
| WO2010137501A1 | 2010-12-02 |
Foreign References:
| JP2011081902A | 2011-04-21 | |||
| JPH07309947A | 1995-11-28 | |||
| JPH06301322A | 1994-10-28 | |||
| US5772905A | 1998-06-30 | |||
| JP2007084625A | 2007-04-05 | |||
| JP2007072374A | 2007-03-22 | |||
| JP2008019292A | 2008-01-31 | |||
| JP2010000612A | 2010-01-07 | |||
| JP2005239975A | 2005-09-08 | |||
| JP2005113049A | 2005-04-28 |
Other References:
See also references of EP 2664628A4
T. BAILEY; B. J. CHOOI; M. COLBURN; M. MEISSI; S. SHAYA; J. G. EKERDT; S. V. SCREENIVASAN; C. G. WILLSON, J. VAC. SCI. TECHNOL., vol. B18, 2000, pages 3572
A. KUMAR; G. M. WHITESIDES, APPL. PHYS. LETT, vol. 63, 1993, pages 2002
T. BAILEY; B. J. CHOOI; M. COLBURN; M. MEISSI; S. SHAYA; J. G. EKERDT; S. V. SCREENIVASAN; C. G. WILLSON, J. VAC. SCI. TECHNOL., vol. B18, 2000, pages 3572
A. KUMAR; G. M. WHITESIDES, APPL. PHYS. LETT, vol. 63, 1993, pages 2002
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
Spring name Kenji (JP)
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Claims: