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Title:
RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLADDED LAMINATED PLATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/201979
Kind Code:
A1
Abstract:
This resin composition contains a curable resin. When a cured product of the resin composition is subjected to thermogravimetric analysis from 30°C to 800°C at a heating rate of 90°C/min, the amount of outgas generated from the cured product between 30°C and 550°C is less than 27 mass% relative to the total mass of the cured product.

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WO/2000/064960THERMOSETTING RESIN COMPOSITION AND FLEXIBLE-CIRCUIT OVERCOATING MATERIAL COMPRISING THE SAME
JP3374317[Title of Invention] Epoxy resin composition and copper-clad laminate
Inventors:
NISHIGUCHI YASUNORI
INOUE HIROHARU
Application Number:
PCT/JP2022/006006
Publication Date:
September 29, 2022
Filing Date:
February 15, 2022
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08G59/20; B32B15/08; C08J5/24; C08L63/00; C08L101/00; H05K1/03
Domestic Patent References:
WO2016002704A12016-01-07
WO2014065422A12014-05-01
WO2018047724A12018-03-15
Foreign References:
JP2017031239A2017-02-09
JP2018080220A2018-05-24
JP2018035327A2018-03-08
JP2018030974A2018-03-01
JP2018016675A2018-02-01
JPH10173008A1998-06-26
JP2011013622A2011-01-20
JP2009276597A2009-11-26
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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